BGA IC powerful demolition glue

Features: BGA IC chips for mobile phones resin sealed plastic softening demolition demolition. Selection DuPont chemical formulation. Department of newest environmentally safe formula. Can quickly soften, loosen the cured phenolic, epoxy, acrylic, polyurethane, silicone gums and other. Phone circuit boards and components without damage.

Usage: the application, use a small piece of cotton wool dipped in glue split, covering the sealed plastic BGA chip, and then board a small plastic bag into the phone closed, horizontally placed 20 minutes after re-done once, and other sealant after softening carefully removed with a needle tool.